现订展位享早鸟价！2026年第八届精密陶瓷暨功率半导体产业链展览会（8月26日-28日·深圳）

精密陶瓷是采用高度精选或合成的原料，具有精确控制的化学组成，并且具有特定的精细结构和优异性能的陶瓷材料。通过对原料进行配制，可以获得具有目标性质的物质，配制的原料通过成型、烧成、磨削等精密控制的加工工艺，形成具有极高的尺寸精度和功能强大的高附加值产品。

? ? ? ?Precision ceramics are ceramic materials made from highly selected or synthetic raw materials, with precisely controlled chemical compositions, specific fine structures, and excellent properties. By formulating the raw materials, substances with targeted properties can be obtained. The formulated raw materials undergo precisely controlled processing techniques such as forming, firing, and grinding to produce high added-value products with extremely high dimensional accuracy and powerful functionality.

? ?由公海gh555000aa线路检测智造独家主办的第八届精密陶瓷暨功率半导体产业链展览会将于2026年8月26-28日在深圳国际会展中心（宝安新馆）举行，汇聚精密陶瓷、电子陶瓷、IGBT/SiC功率半导体等产业链上下游企业，展示了行业最新技术成果和产品应用。

? ?The 8th Precision Ceramics and Power Semiconductor Industry Chain Exhibition, exclusively organized by Aibang Intelligent Manufacturing, will be held from August 26 to 28, 2026, at the Shenzhen International Convention and Exhibition Center (Bao'an New Hall). It will bring together upstream and downstream companies in the precision ceramics, electronic ceramics, IGBT/SiC power semiconductor industries, showcasing the latest technological achievements and product applications in the industry.

? ? 展出2万平米、1,000个摊位、500多家展商、50,000名专业观众；汇聚IGBT/SiC功率半导体产业链；热管理材料产业链，精密陶瓷、电子陶瓷、陶瓷基板、薄膜/厚膜陶瓷电路板、陶瓷封装管壳、LTCC/HTCC/MLCC加工产业链等产业链上下游企业！

? ?An exhibition covering 20,000 square meters, with 1,000 booths, over 500 exhibitors, and 50,000 professional visitors; gathering the IGBT/SiC power semiconductor industry chain; the thermal management materials industry chain, precision ceramics, electronic ceramics, ceramic substrates, thin-film/thick-film ceramic circuit boards, ceramic packaging tubes, and the processing industry chain for LTCC/HTCC/MLCC and other upstream and downstream enterprises!

陶瓷器件及材料：MLCC、LTCC、HTCC、微波介质陶瓷、压电陶瓷、钛酸钡、碳酸钡、氧化钛、氧化铝、氧化锆、玻璃粉、氮化铝、LTCC介质陶瓷粉体、稀土氧化物、生瓷带等；

Ceramic components and materials: MLCC, LTCC, HTCC, microwave dielectric ceramics, piezoelectric ceramics, barium titanate, barium carbonate, titanium oxide, aluminum oxide, zirconium oxide, glass powder, aluminum nitride, LTCC dielectric ceramic powder, rare earth oxides, green ceramic tape, etc.;

精密陶瓷：氧化锆、氧化铝、氮化铝、氮化硅、碳化硅、氧化钇、结构陶瓷、高温陶瓷、透明陶瓷、陶瓷微珠、新能源陶瓷、陶瓷轴承、陶瓷球、半导体陶瓷（搬运臂、陶瓷劈刀、静电卡盘、蚀刻环……）、3D打印陶瓷、燃料电池（SOFC）隔膜片、穿戴陶瓷、光纤陶瓷插芯、陶瓷套筒、CIM、生物陶瓷等。

Precision ceramics: zirconia, alumina, aluminum nitride, silicon nitride, silicon carbide, yttria, structural ceramics, high-temperature ceramics, transparent ceramics, ceramic microspheres, new energy ceramics, ceramic bearings, ceramic balls, semiconductor ceramics (handling arms, ceramic knives, electrostatic chucks, etching rings, etc.), 3D printed ceramics, fuel cell (SOFC) membranes, wearable ceramics, optical fiber ceramic ferrules, ceramic sleeves, CIM, bioceramics, etc.

陶瓷基板及封装外壳：陶瓷封装外壳、DPC、DBC、AMB、HTCC基板、LTCC基板、薄膜电路板、厚膜电路板、陶瓷封装基座、热沉、氧化铝、氮化铝、氮化硅、氧化铍、莫来石粉体及基板等；

Ceramic substrates and packaging shells: ceramic packaging shells, DPC, DBC, AMB, HTCC substrates, LTCC substrates, thin film circuit boards, thick film circuit boards, ceramic packaging bases, heat sinks, aluminum oxide, aluminum nitride, silicon nitride, beryllium oxide, mullite powder and substrates, etc.

金属材料：银粉、金粉、铜粉、镍粉、焊料（焊片、焊膏）、MLCC用内/外电极浆料、LTCC银浆、金浆、钨钼浆料、铜浆、靶材、无氧铜带、可伐合金、金属冲压件等；

Metal materials: silver powder, gold powder, copper powder, nickel powder, solder (solder sheets, solder paste), MLCC inner/external electrode slurry, LTCC silver paste, gold paste, tungsten-molybdenum slurry, copper paste, target materials, oxygen-free copper strips, Kovar alloys, metal stampings, etc.

助剂：陶瓷和导电浆料用分散剂、黏合剂、增塑剂、絮凝剂、矿化剂、消泡剂、润滑剂、烧结助剂等；

Additives: dispersants, binders, plasticizers, flocculants, mineralizers, defoamers, lubricants, sintering aids, etc. for ceramics and conductive pastes.

陶瓷加工设备：砂磨机、球磨机、真空脱泡机、三辊机、喷雾造粒机、干压机、流延机、注塑机、3D打印机、模具、干燥设备、研磨机、精雕机、裁片机、激光设备、打孔机、填孔机、丝网印刷机、叠层机、层压机、等静压机、热切机、整平机、排胶炉、烧结炉、钎焊设备、电镀设备、化学镀、喷银机、浸银机、端银机、真空镀膜设备、显影设备、去膜设备、蚀刻机、湿制程设备、等离子清洗、超声波清洗、自动化设备、剥离强度测试仪、AOI检测设备、打标机；

Ceramic processing equipment: sand mill, ball mill, vacuum degasser, three-roll mill, spray granulator, dry press, casting machine, injection molding machine, 3D printer, molds, drying equipment, grinder, precision engraving machine, cutting machine, laser equipment, punching machine, filling machine, screen printing machine, laminating machine, laminator, isostatic press, hot cutting machine, flattening machine, glue discharge furnace, sintering furnace, brazing equipment, electroplating equipment, chemical plating, silver spraying machine, silver dipping machine, end silver machine, vacuum coating equipment, developing equipment, stripping equipment, etching machine, wet processing equipment, plasma cleaning, ultrasonic cleaning, automation equipment, peeling strength tester, AOI inspection equipment, marking machine;

封装测试设备：贴片机、引线键合机、封盖机、平行缝焊封帽、切筋机、钎焊设备、激光调阻机、网络分析仪、热循环测试设备、测厚仪、氦气检漏仪、老化设备、外观检测、超声波扫描显微镜、X-光检测、激光打标、分选设备、测包编带机等；

Packaging test equipment: chip mounter, wire bonding machine, lid sealing machine, parallel seam welding cap, cutting machine, brazing equipment, laser resistance adjustment machine, network analyzer, thermal cycling test equipment, thickness gauge, helium leak detector, aging equipment, appearance inspection, ultrasonic scanning microscope, X-ray inspection, laser marking, sorting equipment, packaging and tape measuring machine, etc.;

耗材：离型膜、载带（塑料和纸质）、耐火材料、承烧板/匣钵（氧化铝、刚玉莫来石、氮化硼等）、承烧网、发泡胶、研磨耗材（金刚石微粉、研磨液）、精密网版、清洗剂、电镀药水等。

Consumables: release film, carrier tape (plastic and paper), refractory materials, burn-in boards/containers (alumina, corundum mullite, boron nitride, etc.), burn-in meshes, foam glue, grinding consumables (diamond micropowder, grinding liquid), precision screens, cleaning agents, electroplating solutions, etc.

材料：碳化硅，陶瓷衬板（DBC、AMB）、封装管壳、键合丝、散热基板（铜、铝碳化硅AlSiC）、导热硅凝胶、环氧灌封胶、焊料（预制焊片）、银膜/银膏、散热器（铜、铝）、功率引出端子（铜端子）、外壳（工程塑料PPS、PBT、高温尼龙）、清洗剂等；

Materials: Silicon carbide, ceramic liners (DBC, AMB), package housing, bonding wire, heat sink substrate (copper, aluminum silicon carbide AlSiC), thermal silicone gel, epoxy potting compound, solder (preformed solder pads), silver film/silver paste, heat sinks (copper, aluminum), power output terminals (copper terminals), housing (engineering plastics PPS, PBT, high-temperature nylon), cleaners, etc.;

设备及配件：真空焊接炉、贴片机、固晶机、引线键合机、X-ray、推拉力测试机、等离子清洗设备、点胶机、丝网印刷机、超声波扫描设备、动静态测试机、点/灌胶机、银烧结设备、垂直固化炉、甲酸真空共晶炉、自动封盖设备、高速插针机、弯折设备、超声波焊接机、视觉检测设备、推拉力测试机、高低温冲击设备、功率循环测试设备、打标机、检验平台、治具等；

Equipment and accessories: vacuum welding furnace, chip mounter, die-bonding machine, wire bonding machine, X-ray, push-pull testing machine, plasma cleaning equipment, dispensing machine, screen printing machine, ultrasonic scanning equipment, static and dynamic testing machine, dispensing/encapsulation machine, silver sintering equipment, vertical curing furnace, formic acid vacuum co-precipitation furnace, automatic sealing equipment, high-speed pin insertion machine, bending equipment, ultrasonic welding machine, visual inspection equipment, push-pull testing machine, high and low temperature impact equipment, power cycling testing equipment, marking machine, inspection platform, fixtures, etc.;

温小姐：18126443075（同微信）

邮箱：ab019@aibang.com

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龙小姐：18318676293（同微信）

邮箱：ab036@aibang.com

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